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基于一维相控阵列的高压电缆终端铅封缺陷三维成像检测

Three-Dimensional Imaging Detection of Lead Seal Defects in High-Voltage Cable Terminations Using a One-D Phased Array

  • 摘要: 针对二维图像在高压电缆终端铅封缺陷三维表征中的局限性,本文提出一种基于一维相控阵的高压电缆终端铅封缺陷三维成像检测方法。通过激光点云技术获取铅封表面三维数据,结合NURBS曲线拟合与等弧长离散算法规划检测路径,并设计耦合装置解决复杂曲面声束耦合问题;基于自适应几何掩膜和特征提取算法对序列图像进行预处理,最终通过体素绘制进行三维重建。结果表明:三维成像结果清晰表征缺陷的分布特征与柱状形貌;缺陷深度的绝对误差为−0.6~−0.2 mm,相对误差为−6% ~−1.3%;孔深最大相对误差约为±8%;体积量化相对误差满足工业检测精度要求。该方法实现了铅封内部缺陷的三维形貌重构与定量评估,为电缆终端的全生命周期管理提供了技术支撑。

     

    Abstract: Aiming at the limitations of two-dimensional images in three-dimensional characterization of defects in the lead seals of high-voltage cable terminations, this paper proposes a three-dimensional imaging inspection method for lead seal defects based on a one-dimensional phased array. The method acquires three-dimensional point cloud data of the lead seal surface using laser scanning, plans the inspection path by integrating NURBS curve fitting with an equal-arc-length discretization algorithm, and designs a coupling device to address acoustic beam coupling challenges on complex curved surfaces. Sequential B-scan images are preprocessed using adaptive geometric masking and feature extraction algorithms, and final three-dimensional reconstruction is achieved via volume rendering. Results show that: (1) the 3D imaging clearly characterizes the spatial distribution and columnar morphology of defects; (2) the absolute error in defect depth ranges from −0.6 mm to −0.2 mm, with a relative error of −6% to −1.3%; (3) the maximum relative error in through-hole depth is approximately ±8%; and (4) the relative error in volumetric quantification satisfies the accuracy requirements for industrial inspection. This method enables 3D morphological reconstruction and quantitative evaluation of internal defects in lead seals, thereby providing technical support for full-lifecycle management of high-voltage cable terminations.

     

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