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单层宽频柔性微穿孔板的加工方法和声学特性研究

Study on the fabrication method and sound absorption performance of single-layer wide-band flexible micro-perforated plate

  • 摘要: 针对单层微穿孔板吸声带宽较窄、常规加工方法难以制造超微孔径微穿孔板等技术现状,着重研究了具有较宽吸声频带的单层柔性超微孔微穿孔板的加工方法,包括微机电系统(Micro-Electro-Mechanical System,MEMS)模板浇铸脱模法、热压印穿孔法、针辊式穿孔法、数控铣床穿孔法,并比较、分析了这些加工方法各自的特点。其中MEMS模板浇铸脱模法和数控铣床穿孔法都可以实现孔径小于100 μm的超微孔柔性微穿孔板加工。前者可以实现批量化加工,但成本较高;后者加工精确,但不适合孔径过小、穿孔密度太大的柔性微穿孔板批量化加工。热压印穿孔法和针辊式穿孔法可以实现批量化加工,不过难以加工出孔径100 μm以下的超微孔,且加工误差较大。进而,加工了多种柔性材质的微穿孔板膜片,包括聚二甲基硅氧烷,硬纸板,聚氯乙烯(Polyvinyl Chloride,PVC),聚碳酸酯,耐高温聚酯。其中,采用数控铣床穿孔法加工的PVC微穿孔板膜片有较好的吸声性能,部分单层PVC微穿孔板的吸声带宽可以达到3倍频程。

     

    Abstract: In order to improve the acoustic properties of single layer micro-perforated plate limited by conventional processing technology, several approaches to fabricating flexible micro-perforated plate, including micro-electro-mechanical system (MEMS) molding, hot imprinting, needle roller puncturing, and computerized numerical control (CNC) milling, are studied in this paper. Both MEMS molding and CNC milling are capable of manufacturing apertures less than 100 microns; batch processing can be realized with MEMS molding, but the process to develop MEMS mold is time consuming and costly. The CNC milling is accurate, but it is not suitable for batch processing of flexible micro-perforated plates with too small aperture and too high perforation density. Batch processing can also be achieved with hot imprinting and needle roller puncturing, but it is difficult to manufacture apertures below 100 microns, and the machining error is significant. For comparison, a variety of polymer materials, including Polydimethylsiloxane, Paperboard, Polyvinyl Chloride (PVC), Polycarbonate, Polyethylene Terephthalate, are used to develop flexible micro-perforated plates, among these, PVC micro-perforated plates processed by CNC milling have better sound absorption performance, the maximum bandwidth of single layer PVC absorber reaches 3 octaves.

     

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